ASMPT Fully Automated solder paste printer DEK GALAXY
Newly developed DEK Typhoon high-speed stencil cleaning system
Maximum flexibility and speed for under stencil cleaning with flexible insert types and chamber lengths for optimal cleaning performance for every process and stencil.
Material Management
The combination of DEK Paste Roll Height Monitor and DEK Automatic Paste Dispenser (cartridge or can) controls the paste quantity automatically.
DEK Multiple Alignment of Singulated Substrates (MASS)
Multiple substrates are optically aligned at the same time – a technological breakthrough for efficient and high-precision printing processes with singulated substrates
DEK Virtual Panel Tooling (VPT)
DEK Virtual Panel Tooling (VPT) allows the printer to process multiple individual substrates in a single print cycle.
DEK HawkEye®
DEK HawkEye® quickly verifies the printing results within the printer itself.
| Machine type | DEK Galaxy |
| Standard configuration | Description |
| System alignment accuracy* | >2.0 cmk @±12.5μm,(±6 sigma) |
| Wet print accuracy | >2.0 cpk @±17.5 μm,(±6 Sigma) |
| Optimum cycle time (CCT) | 7 seconds |
| Maximum pressure range | 600 mm(X)×508.5 mm (Y) |
| Controller | Motion control via CAN BUS network |
| User interface | Touchscreen,keyboard and trackball,Instinctiv V9 software,Windows 10 loT Enterprise |
| Camera | HawkEye®1700 Digital camera with IEEE 1394 interface Multi-channel LED illumination,FOV 11.3 mm×8.7 mm,inspection window 75 mm² |
| Axle drive | High-precision linear motors and encoders with 1 μm accuracy |
| Squeegee pressure control | Software-controlled,motorized,with closed-loop control circuit |
| Template positioning | Automatic loading system with drip tray for squeegee |
| Stencil alignment | Motorized via actuators(X,Y,and theta) |
| Underside cleaning | DEK Typhoon high-speed cleaner,fully programmable with wet/dry/vacuum wiping, external solvent tank (300 mm,400 mm,460 mm,515 mm) |
| Substrate size(min.) | 50 mm (X)×40.5 mm (Y) |
| Substrate size(max.) | 620 mm (X)**×508.5 mm(Y) |
| Machine dimensions(approx.) | 2060 mm×1500 mm×1570 mm(81.1“×59“×61.8“)(L×W×H) |
| Compressed air supply | According to ISO 8573.1 Standard Quality Class 2.3.3.pressure:5-8 bar Consumption,normal:51/min,at 5-8 bar.Consumption,maximum 2261/min,at 6 bar |
| Lester | 840 kg,packed (depending on configuration) 680 kg,unpacked (depending on configuration) |
| Options | |
| DEK Paste Management | Automatic solder paste application and automatic height control of the paste roller |
| ProFlow | Facultatif |
| Closed-loop connection to SPl systems | Advanced solder paste control with ProDEK |
| Semiconductor options | SEMI S2/S8,SECS GEM,VPT tooling,DirEKT,Ball Placement,MASS |
| *The measurement of machine and repeat accuracy is carried out with process variables typical for production. ** Longboard option | |
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