High - Precision Dispensing Machine Solution For Post - Processing Of CCS In EV Power Batteries - Haichen SMT

Índice

I. Industry Analysis(Why we need dispensing machine in production)

Recent research shows FPC demand for new energy vehicle power batteries is surging, emerging as a key growth driver. Latest data indicates FPC’s share in automotive PCBs has risen from 12% to 15%.

FPC applications cover vehicle lighting, display modules, core power control systems (BMS/VCU/MCU), sensors, ADAS, etc. Estimates suggest over 100 FPCs per vehicle, with new energy vehicles drastically boosting demand for power battery – used FPCs.

Sampling lines, critical for BMS systems, monitor battery cell voltage/temperature and provide protection. FPCs replace traditional copper wire harnesses in power batteries.

FPC manufacturers are expanding into downstream CCS integration. Institutional forecasts show CCS value per vehicle could reach 2 – 3x that of FPCs.

II. What is CCS

CCS (Cells Contact System), also known as integrated busbar or wiring harness board assembly, consists of FPC, plastic structural components, copper-aluminum busbars, etc. As part of the vehicle’s BMS power system, its FPC replaces the power battery’s sampling lines. New energy vehicle power batteries typically comprise multiple battery modules, with each module corresponding to 1 CCS, which generally configures 1-2 FPCs.

FPC (Flexible Printed Circuit), made of flexible insulating substrates, serves as a key electronic interconnection for conducting and transmitting signals. Featuring high integration, ultra-thin thickness, and extreme flexibility, FPC excels in safety, lightweight design, and neat layout.

Widely applied in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras, etc., FPC is a mature technology. Its use in battery modules is particularly suitable, replacing partial low-voltage wiring harnesses and even some small-current high-voltage current carriers.

CCS Dispensing Solution (Existing Case):

Conveyor + Plasma Cleaner + High-Speed Dispenser (for connectors) + Conveyor + High-Energy LED Curing Oven + Conveyor + High-Speed Dispenser 1 (for nickel sheets) + High-Speed Dispenser 2 (for nickel sheets) + Conveyor + Low-Energy LED Curing Oven + Conveyor

CCS Dispensing Solution

The adhesives primarily used for CCS dispensing and encapsulation include UV glue, yellow glue, thermal conductive silicone, and silicone adhesive/sealant:

UV Glue
Mainly applied to nickel sheets on FPC to reinforce and protect soldering points.
Yellow Glue
Used for fixing electronic components such as inductors, coils, transformers, electrolytic capacitors, and receivers, providing protection and sealing for electronic parts. In CCS, it is applied for encapsulation of electrical components, high-voltage parts, and moisture-proof coating of battery FPC.
Thermal Conductive Silicone
Designed to fill gaps between heat-generating components and cooling devices, expanding their contact area to enhance thermal conductivity. This effectively dissipates heat from electronic components during operation. In CCS, it serves as a thermal interface material between heat sources (power transistors, thyristors, heating elements, etc.) and cooling facilities (heat sinks, cooling strips, housings, etc.), improving heat dissipation efficiency.
Silicone Adhesive/Sealant
Suitable for encapsulation, insulation, and flame retardancy in electronic modules, sensors, and components, as well as bonding/fixing electronic parts and insulating between components.

Overview:
HaichenSMTs HC-D1200S Series Dispensing & Filling System excels in precision and high-speed applications, featuring both contact and non-contact quantitative dispensing methods. It ensures uniform glue output and clean cutoff, eliminating defects such as stringing, uneven adhesive volume, and component damage. This system significantly enhances productivity and product quality. Equipped with versatile functional modules, it offers flexible applications and stands as the premier choice for precision dispensing and filling tasks.
Applications:
Underfill
FPC Encapsulation
FPC Connector & Nickel Sheet Dispensing
SMT Red Glue Dispensing
LED Encapsulation
Component Encapsulation
Solder Paste Dispensing
Red/Black Glue Dispensing
Narrow-Pitch Screen Inkjet Printing
Semiconductor Packaging
Wafer Fixation

Work Process：Board Loading→Conveyor to Work Area→Board Positioning→Visual Alignment→Photography→Laser Height Measurement→Dispensing Operation→Board Unloading

Contacte-nos para obter uma proposta de preços

Na Haichen SMT, dedicamo-nos a fornecer apoio e assistência excepcionais aos nossos clientes em todo o mundo. Quer tenha dúvidas sobre os nossos produtos, necessite de apoio técnico ou queira discutir uma solução personalizada para as suas necessidades de montagem de PCB, a nossa equipa está pronta para o ajudar. Entre em contacto connosco utilizando as informações abaixo e vamos iniciar uma conversa sobre como o podemos ajudar a ter sucesso.