Sailyond 2D PCBA AOI (SI-2020C/D Series)

VIEWZOOM Venus 510

Comprehensive detection mode：3D + 2D + 4D

Combining 3D and planar

Venus 510 Key Advantages

Detection Performance: Fully covers all component types, enables full inspection of 35mm components, and solves PCB warpage problems with integrated hardware & software solutions.
One-click Programming: Changeover programming takes as little as 5 minutes, supports precision mode switching, and ensures consistent detection via excellent equipment consistency.
4D Imaging: All Venus series can be optionally equipped with 4D imaging (with 8-light machine) and high-precision 3D imaging. The exclusive 4D imaging solution enables high-quality and efficient inspection.

Real 3D Algorithms

3D check the thickness of the solder paste

Through sampling operations, extracting solderpastefrom flat or 3D physical shapes.
According tochoose points withsampling, automatically definiteheight range of extracting solderpaste.
Abovesubstrateplane toextracting, completely unaffected by substrate color changes.

OCR Solve the Problem of Wrong and Polarity Check

Accurately identifyingcases

Optimal Short Circuit Algorithm

Solve the problem of ink interference in 2D short circuit detection PCB through high filtering.

Standard with Multiple Types of Bar code Detection Abilities

Software has embedded a bar code recognition system, which automatically checks and identifies various types of bar codes onthe substrate.

Model		SI-2020C	SI-2020D
PCB Specifications	PCB Transfer Size	50mm50mm-510mm460mm	Single Board Mode:50mm50mm-510mm600mm Double Board Mode:50mm50mm-510mm330mm
	PCB Inspection Size	50mm50mm-510mm460mm	Single Board Mode:50mm50mm-510mm600mm Double Board Mode:50mm50mm-510mm330mm
	PCB Thickness Range	0.6-6mm
	Maximum PCB Weight	10kg
	Component Height	Top 25mm
		Bottom 40mm
	PCB Transfer Method	Belt Conveyor
	Edge Width	3mm
Optical Specifications	Camera Pixel	12MP Industrial Area Color Camera,Cell:2.5um
	Recognition Accuracy	12um
	Light Source Solution	Four-color Integral Ring Light Source:White+Red Green Blue
	Optical Lens	Double-sided Telecentric Lens
	Camera Field of View	12MP@12um:50mm*50mm
Inspection Related	Scanning Speed	0.3sec/FOV
	Component Inspection	Missing,Wrong,Misplaced,Standing,Polar Reverse
	Solder Inspection	Multi-solder,Less-solder,Connected-solder,False-solder
	Component Library	NA
	Special Feature	One-key Programming
Device Specifications	Device Working Mode	Standard SMEMA Front and Rear Communication Port
	Front and Rear Device Docking Height	880mm-920mm
	Front and Rear Device Communication Protocol	One-key Programming
	Storage Memory	64G
Hardware Specifications	Storage Memory	CPU:Intel i5 Graphics Card:NVIDIA RTX3060Ti Storage:M.2 Solid State Drive 512G+4T Mechanical Hard Drive Operating System:Windows 10 *Adjustable according to actual conditions
	Monitor	24-inch Monitor
	Board Width Adjustment	Automatic/Manual
	Motion Control	Servo Motor+Ball Screw
Device Size	Device Weight	Approximately 700KG	Approximately 850KG
	DepthWidthHeight	1020mm1196mm1590mm	1020mm1596mm1590mm
Electric and Environment	Stroomvoorziening: Power Source	L+N+G
	Stroomvoorziening: Voltage/Frequency	AC220V±10%/50Hz
	Power	2.7KW	3KW
	Gas Supply	0.4-0.7Mpa,5L/min
	Operating Environment	Temperature 10~30°℃,Relative Humidity 35~80%

Original Soldering Algorithm

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