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VIEWZOOM Venus 510

Comprehensive detection mode:3D + 2D + 4D

Combining 3D and planar

Venus 510 Key Advantages 
  • Detection Performance: Fully covers all component types, enables full inspection of 35mm components, and solves PCB warpage problems with integrated hardware & software solutions.
  • One-click Programming: Changeover programming takes as little as 5 minutes, supports precision mode switching, and ensures consistent detection via excellent equipment consistency.
  • 4D Imaging: All Venus series can be optionally equipped with 4D imaging (with 8-light machine) and high-precision 3D imaging. The exclusive 4D imaging solution enables high-quality and efficient inspection.

Real 3D Algorithms

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3D check the thickness of the solder paste

  • Through sampling operations, extracting solderpastefrom flat or 3D physical shapes.
  • According tochoose points withsampling, automatically definiteheight range of extracting solderpaste.
  • Abovesubstrateplane toextracting, completely unaffected by substrate color changes.

OCR Solve the Problem of Wrong and Polarity Check

Accurately identifyingcases

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Optimal Short Circuit Algorithm

Solve the problem of ink interference in 2D short circuit detection PCB through high filtering.

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Standard with Multiple Types  of Bar code Detection Abilities

Software has embedded a bar code recognition system, which automatically checks and identifies various types of bar codes onthe substrate.

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الطرازSI-2020CSI-2020D
PCB
Specifications
PCB Transfer Size50mm*50mm-510mm*460mmSingle     Board     Mode:50mm*50mm-510mm*600mm

Double     Board     Mode:50mm*50mm-510mm*330mm
PCB Inspection Size50mm*50mm-510mm*460mmSingle     Board     Mode:50mm*50mm-510mm*600mm

Double     Board     Mode:50mm*50mm-510mm*330mm
PCB Thickness Range0.6-6mm
Maximum PCB Weight10kg
Component HeightTop 25mm
Bottom 40mm
PCB Transfer MethodBelt Conveyor
Edge Width3mm
Optical
Specifications
Camera Pixel12MP Industrial Area Color Camera,Cell:2.5um
Recognition Accuracy12um
Light Source SolutionFour-color Integral Ring Light Source:White+Red Green Blue
Optical LensDouble-sided Telecentric Lens
Camera Field of View12MP@12um:50mm*50mm
Inspection
Related
Scanning Speed0.3sec/FOV
Component InspectionMissing,Wrong,Misplaced,Standing,Polar Reverse
Solder InspectionMulti-solder,Less-solder,Connected-solder,False-solder
Component LibraryNA

Special Feature
One-key Programming
Device
Specifications

Device Working Mode

Standard SMEMA Front and Rear Communication Port
Front and Rear Device
Docking Height
880mm-920mm
Front and Rear Device
Communication Protocol
One-key Programming
Storage Memory64G
Hardware
Specifications
Storage MemoryCPU:Intel i5
Graphics Card:NVIDIA RTX3060Ti
Storage:M.2 Solid State Drive 512G+4T Mechanical Hard Drive

Operating System:Windows 10
*Adjustable according to actual conditions
Monitor24-inch Monitor
Board Width AdjustmentAutomatic/Manual
Motion ControlServo Motor+Ball Screw
Device SizeDevice WeightApproximately 700KGApproximately 850KG
Depth*Width*Height1020mm*1196mm*1590mm1020mm*1596mm*1590mm
Electric and
Environment
مزود الطاقة:
Power Source
L+N+G
مزود الطاقة:
Voltage/Frequency
AC220V±10%/50Hz
Power2.7KW3KW
Gas Supply0.4-0.7Mpa,5L/min
Operating EnvironmentTemperature 10~30°℃,Relative Humidity 35~80%

 

Original Soldering  Algorithm

 

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