PRINCIPLE OF PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY
Phase Modulation Profilermetry(PMP) is used to achieve three-dimensional measurement of printed solder paste, which can greatly improve measurement accuracy while ensuring high-speed inspection.
RGB TUNE ACTIVE THREE-COLOR AND 2D LIGHT SOURCE
Patented RGB Tune function takes Red, Green and Blue images and with unique filter algorism, to solve solder bridge detection false alarm and relative zero surface uncertain issue. In the mean time, provide the 2D/3D measurements and image of printed solder paste. ooperate with 2D lighting sources avoids problems caused by the angle of the red RGB color distortion effect in solder; RGB tuning in Different PCB colors is more versatile ; Fulfill a variety of dispensing process testing ; greatly improve the equipment ( height ,volume , area ) repeatability accuracy.
HIGH-RESOLUTION IMAGE PROCESSING SYSTEM
It provides a variety of detection accuracy of 2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the customer’s requirements for product diversity and detection speed.
Z-AXIS DYNAMIC COMPENSATION +STATIC COMPENSATION THROUGH TELECENTRIC LENS
Solves the problem of ordinary lens, squint and deformation by using high-cost telecentric lens and special software test algorithm, which greatly enhances the inspection accuracy and inspection ability. Achieves the industry\’s leading static compensation for FPC warping.
FIVE-MINUTE PROGRAMMING AND ONE-CLICK OPERATION
Engineers with any levels of experience can independently program the system quickly and accurately through Gerber importing software module and the friendly programming interface. One-button operation by the operator is designed also greatly reduces the requirements for training.
| 技术平台/Technology Platform | 标准Type-B/C(Standard TYPE-B/C) |
| 适用系列/Series InSPlre/S/F/Hero/Ultra/B/I SERIES | |
| 型号Model | 510B/510C/630/2020 |
| 测量原理/Measurement Principle | 3D白光PSLM PMP(可编程结构光栅相位调制轮廓测量技术) 3D white light PSLM PMP(Programmable Spatial Light Modulation,Phase Measurement Profilometry) |
| 测量项目/Measurements | 体积，面积，高度，XY偏移，形状(volume,acreage,height,XY offset,shape) |
| 检测不良类型/Detection of Non-Performing Types (missing print,insu c、ie 锡t、in多,e 、es 、t 、ri 、fs 染-shapes,surface contamination) | |
| 镜头解析度/Lens Resolution | 4.5μm/5μm/6μm/8μm/10μm/12μm/15μm/16μm/18μm/20μm(针对不同相机型号可选) |
| 精度/Accuracy | XY(Resolution):10μm |
| 重复精度Repeatability | height:≤1μm(4 Sigma);volume/area:<1%(4Sigma); |
| 检测重复性/Gage R&R | <<10% |
| 检测速度/Inspection Speed | 0.35sec/FOV-0.5sec/FOV(根据实际配置确定，According to the actual configuration) |
| 检测头数量/Quanlity of Inspection Head | 标准1个，选配2个，3个(Standard 1,option 2,3) |
| 基准点检测时间/Mark-point Detection Time | 0.3sec/piece |
| 最大检测高度/Maximun MeauringHead | ±550μm(±1200μm as option) |
| 弯曲PCB最大测量高度 Maximun Measuring Height of PCB Warp | ±5mm |
| 最小焊盘间距/Minimun Pad Spacing | 100μm(焊盘高为150μm焊盘为基准)80μm/100μm/150μm/200μm(根据实际配置确定) |
| 最小元件/Minimum element | 01005/03015/008004(可选， option) |
| 最大PCB载板&检测尺寸 Maximun Loading PCB&Detection Size(X*Y) | 450x500mm(510B,2020)470×500mm(510C)630x686mm(630) |
| 定动轨设置/Conveyor Setup | 前定轨(后定轨选件)front orbit(back orbit as option) |
| PCB传送方向/PCB Transfer Direction | 左到右或右到左(Left to right or Right to left) |
| 轨道宽度调整/Conveyor Width Adjustment | 手动&自动(manual&automatic) |
| 工程统计数据SPC/Engineering Statistics | Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports |
| Gerber和CAD导入Gerber&CAD Data Import | 支持Gerber格式(274x,274d),人工Teach模式， CADX/Y,Part No.,Package Type等导入； support Gerber format(274x,274d),manual Teach model);CADX/Y,Part No.,Package Typeimput) |
| 操作系统技持/Operating System Support | Windows 10 Professional(64 bit) |
| 设备规格/Equipment Diemension and Weight | W1000xD1150xH1530(510B,2020),965Kg W1000xD1174×H1530(510C),985Kg W1180×D1330xH1530(630),1160Kg |
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